1. Koushik Ramachandran, Timothy Pruyn, Timothy Huang, Yushu Wang, Preet M. Singh, W. Jud Ready, Rosario A. Gerhardt, Venky Sundaram, and Rao Tummala. “Investigation of Copper Plated-Through-Holes in Glass Fiber Reinforced Epoxy Substrates Using AC Impedance Spectroscopy.” Accepted for publication in Journal of Materials Science: Materials in Electronics (2015).
  2. Philip M. Campbell, Alexey Tarasov, Corey A. Joiner, W. Jud Ready, and Eric M. Vogel. “Enhanced Resonant Tunneling in Symmetric 2D Semiconductor Vertical Heterostructure Transistors.” DOI: 10.1021/nn507174c; ACS Nano (2015).