- Koushik Ramachandran, Timothy Pruyn, Timothy Huang, Yushu Wang, Preet M. Singh, W. Jud Ready, Rosario A. Gerhardt, Venky Sundaram, and Rao Tummala. “Investigation of Copper Plated-Through-Holes in Glass Fiber Reinforced Epoxy Substrates Using AC Impedance Spectroscopy.” Accepted for publication in Journal of Materials Science: Materials in Electronics (2015).
- Philip M. Campbell, Alexey Tarasov, Corey A. Joiner, W. Jud Ready, and Eric M. Vogel. “Enhanced Resonant Tunneling in Symmetric 2D Semiconductor Vertical Heterostructure Transistors.” DOI: 10.1021/nn507174c; ACS Nano (2015).