Prior to 2010

Prior to 2010

  1. X.J. Wang, J.D. Flicker, B.J. Lee, W.J. Ready and Z.M. Zhang, “Visible and Near-infrared Radiative Properties of Vertically Aligned Multi-walled Carbon Nanotubes.” Nanotechnology, Vol. 20 pp. 215704-215713, (2009).
  2. Jack Flicker and Jud Ready, “Simulations of Absorbance Efficiency and Power Production of Three Dimensional Tower Arrays for Use in Photovoltaics.” Journal of Applied Physics, Vol. 103, pp. 113110 (2008).
  3. K.L. Kepple, G.P. Sanborn, P.A. Lacasse, K.M. Gruenberg, W.J. Ready, “Improved Fracture Toughness of Carbon Fiber Composite Functionalized with Multi Walled Carbon Nanotubes, Carbon, Vol. 46, pp. 2026 –2033, (2008).
  4. S.P. Turano, J.D. Flicker; W.J. Ready, “Nanoscale Coaxial Cables Produced From Vertically Aligned Carbon Nanotube Arrays Grown via Chemical Vapor Deposition and Coated with Indium Tin Oxide via Ion Assisted Deposition.” Carbon, Vol. 46, No. 5, pp. 723-728, (2008).
  5. W.J. Ready and Stephan P. Turano. “Chemical Vapor Deposition Synthesis of Self Aligned Carbon Nanotube Arrays.” Journal of Electronic Materials, Vol. 35, No. 2, pp. 192-194, (2006).
  6. W.J. Ready and L. J. Turbini. “The Effect of Flux Chemistry, Applied Voltage, Conductor Spacing and Temperature on Conductive Anodic Filament Formation.” Journal of Electronic Materials, Vol. 31, No. 11, pp. 1208-1224, (2002).
  7. Laura J. Turbini, Westin R. Bent, and W. Jud Ready. “Impact of Higher Melting Lead-Free Solders on the Reliability of Printed Wiring Assemblies.” Journal of Surface Mount Technology, Vol. 13, No. 4, pp. 10-14, (2000).
  8. W. J. Ready, and L. J. Turbini. “A Comparison of Hourly vs. Daily Testing Methods for Evaluating the Reliability of Water Soluble Fluxes.” IEEE Transactions on Components, Packaging, and Manufacturing Techniques – Part B, Advanced Packaging, Vol. 23, No. 2, pp. 285-292, (2000).
  9. W. Jud Ready, Laura J. Turbini, Roger Nickel, and John Fischer. “A Novel Test Circuit for Detecting Electrochemical Migration and Conductive Anodic Filament.” Journal of Electronic Materials, Vol. 28, No. 11, pp. 1158-1163, (1999).